Vapor Chamber Vacuum chamber soaking plate is similar to heat pipe in principle, but different in conduction mode. The heat pipe is one-dimensional linear heat conduction, while the heat in the vacuum cavity soaking plate is conducted on a two-dimensional surface, so the efficiency is higher.

VC Features and application scenarios:

VC It is usually used for electronic products requiring small size or rapid dispersion of high heat. At present, it is mainly used in 5G mobile phones, servers, high-end graphics cards and other products. It is a strong competitor of the heat pipe cooling method.

The characteristics of VC：

The liquid at the bottom of the vacuum chamber absorbs the heat of the chip, evaporates and diffuses into the vacuum chamber, conducts the heat to the cooling fin, and then condenses into liquid back to the bottom.

The advantage of VC：

The heat is conducted on a two-dimensional surface, so the heat dissipation efficiency is quite high.

The disadvantages of VC：

Copper surface is susceptible to natural oxidation.

Material costs are high.