The power consumption and heating of notebook computers are increasing with the enhancement of CPU and GPU performance. In order to maintain the stable operation of the system, based on the limited heat dissipation space and the realistic demand for rapid heat dissipation, the heat dissipation scheme of the laptop is generally presented in the form of combination, heat dissipation module is the most important heat dissipation mode of contemporary electronic products. Thermal Module is a thermal module used for cooling systems/devices/equipment. In the early period, it was specifically used for the cooling device of notebook computers, and in the later period, it was widely used for the cooling device of thermal ducting PCS and projectors. Based on the internal space structure of the laptop, the heat dissipation solution combines the heat sink, heat pipe, fan and other components with appropriate design. Through the composite of the heat dissipation components, the components cooperate with each other to improve the heat conduction and heat dissipation ability of the electronic products and ensure the stability of the heat dissipation effect.

 

Notebook cooling module equipment has become one of the major manufacturers in recent years, the core temperature of the laptop depends on the heat dissipation module, and the heat dissipation performance of the heat dissipation module depends on its structure. These structures mainly include heat dissipation base, heat pipe, heat dissipation fin, heat dissipation fan and other objects. When the computer CPU is running, the heat generated by its operation is transferred to the heat dissipation plate and transferred to the vicinity of the heat dissipation fan through the heat pipe. The air convection formed by the rotation of the heat dissipation fan is used to dissipate the heat to the outside of the body.

Because of the limitation of the volume of the laptop and the existence of the marginal effect of the heat dissipation of the components, blindly increasing the number of the major components in the heat dissipation module can not magnify the heat dissipation effect indefinitely. Therefore, it is necessary to have a comprehensive understanding of the heat dissipation and the characteristics of the heat dissipation material, and carry out a comprehensive design. The heat fin, referred to as the heat fin, is a medium directly in contact with the CPU and directly absorbs heat. Because different metals have different characteristics, the heat dissipation fin material has different effects on the heat dissipation effect. For example, aluminum fins have a lower cost and better heat dissipation, while copper fins conduct heat faster. Given that aluminum fins need a certain size and a certain number of heat pipes to be fully functional, copper fins would be more appropriate in a laptop. In addition, the size of the surface area of the fin will also affect the final heat dissipation effect, the larger the surface area, the better the heat dissipation effect; The smaller the surface area, the worse the heat dissipation.

Heat pipe, a widely used heat transfer element, is a heat conductor with the highest heat transfer efficiency. It is usually composed of a shell, a liquid suction core and a working medium, and is divided into three parts: evaporation section, adiabatic section and condensation section. Heat pipes transfer heat through evaporation and condensation of the working medium in the fully closed shell, and the heat transfer efficiency is high and the speed is fast. The factors related to heat pipe cooling efficiency are the diameter, number, length, degree of curvature and degree of flatness of heat pipe. Generally speaking, the flatter the copper tube, the slower the heat convection, the worse the thermal conductivity. Two heat pipes are sufficient to handle the heat generated by the full load of most home and office cpus without overclocking. For high-end cpus, four to eight heat conduction pipes are required. In general, the heat pipe from the chip to the fin from the distance is shorter, the diameter is thicker, fewer bending times, bending Angle is smaller, the number of more, the better the heat dissipation performance. Heat dissipation fan belongs to the type of active heat dissipation system. The heat dissipation fan of a laptop computer can create strong convection when running, and carry away the heat transmitted by other heat dissipation components through the air. The higher the speed of the cooling fan, the greater the air volume. Currently, the commonly used types of fans for laptops are axial fans and radial fans (centrifugal blowers).

Axial fan flow direction

Different combinations and designs of notebook heat dissipation modules will affect the efficiency of notebook heat dissipation, so it can not simply refer to a parameter to draw conclusions about its heat dissipation performance. In addition to these important heat dissipation components, the design of the heat dissipation hole of the laptop and the selection of the body metal are all related issues that need to be paid attention to in the heat dissipation of the laptop. In addition to the combination of heat dissipation schemes, the heat resistance of heat dissipation components should also be considered for the final effect of heat dissipation. Thermal resistance principle and schematic diagram.

Thermal resistance value represents the resistance of heat in the process of transmission, which is a common method used to evaluate the performance of radiator. The detection of heat dissipation efficiency is an indispensable process in the research and development, manufacturing and quality management of radiator products.