The water-cooled (liquid cooled) cooling system uses the pump to circulate the coolant in the cooling pipe and dissipate heat. The heat absorbing part on the radiator (called the heat absorbing box in the liquid cooling system) is used to absorb heat from the new energy battery power pack, 5G communication equipment, IGBT controller, UPS and energy storage system, heat dissipation of large photovoltaic inverter, and SVG/SVC heat dissipation. The heat absorbed by the heat absorbing part is discharged to the outside through a radiator designed on the back of the pyrogen.

In the field of power electronic control, conversion, drive, signal transmission and other fields as well as in the field of new energy (new energy vehicle power battery cooling, UPS and energy storage system cooling, large server cooling, large photovoltaic inverter cooling, SVG/SVC cooling, etc, Liquid cooling technology has become the preferred thermal management method.

Selection of liquid cooling plate for buried pipe process:

Shallow buried pipe process: it is applicable to single side installation of devices. After being flattened, the copper pipe is milled with the aluminum plate at the same time, which is fully conducive to the high thermal conductivity of the copper pipe to take away heat. The lightweight aluminum can reduce weight and control cost.

Deep buried pipe process: the suitable filler is the high thermal conductivity epoxy resin imported from the United States. In the case of low temperature difference requirements for the two-sided components, the components can be installed on one side and on both sides. Because the thickness of the copper pipe is not subject to secondary processing, and the filler protection can provide application safety, especially suitable for the use of cold plates with refrigerant as the medium.

Double side pipe clamping process: the device is installed on both sides, with simple process and low cost; Aluminum plate+aluminum tube&copper tube&stainless steel tube.