Air cooling technology can be regarded as one of the earliest popular traditional heat dissipation methods. It uses the characteristics of heat convection and diffusion to follow the flow of wind speed with air as conductor and take away the heat generated by PC hardware.

At present, most data servers, storage servers and cloud servers adopt forced air cooling and heat dissipation structure, and use fan and heat pipe fin welding technology to conduct heat conduction and cooling of server CPU chips. The air-cooled heat dissipation method uses the heat sink to transfer the heat emitted by the CPU to the heat sink, and then blows the heat away by the fan. Therefore, air conditioning is also needed to cool the environment.

Vapor Chamber is usually used for electronic products requiring small size or rapid dispersion of high heat. At present, it is mainly used in 5G mobile phones, servers, high-end graphics cards and other products. It is a strong competitor of the heat pipe cooling method.

At present, most data servers, storage servers and cloud servers adopt forced air cooling and heat dissipation structure, and use fan and heat pipe fin welding technology to conduct heat conduction and cooling of server CPU chips. The air-cooled heat dissipation method uses the heat sink to transfer the heat emitted by the CPU to the heat sink, and then blows the heat away by the fan. Therefore, air conditioning is also needed to cool the environment.

Heat pipe radiator is a new product which can make great improvement to many old heat sink or heat exchange product and system by using heat pipe technology. Heat pipe radiators are naturally cooled and forced air cooled.

The thermal resistance value of air-cooled heat pipe radiator can be made smaller. It is often used in power electronics, IGBT, inverter, transformer, high-power power supply, LED lamps, servers, computers, medical products and so on.