At present, most data servers, storage servers and cloud servers adopt forced air cooling and heat dissipation structure, and use fan and heat pipe fin welding technology to conduct heat conduction and cooling of server CPU chips. The air-cooled heat dissipation method uses the heat sink to transfer the heat emitted by the CPU to the heat sink, and then blows the heat away by the fan. Therefore, air conditioning is also needed to cool the environment.

The projector works continuously in a narrow space for a long time, and the bulb will emit huge heat. At the same time, the built-in projector voltage stabilized power supply will also emit a lot of heat. If it is not distributed in time, the projector will generate high temperature inside, which will not only reduce the working efficiency of the projector, but also shorten its service life.

The power consumption and heating of notebook computers are increasing with the enhancement of CPU and GPU performance. In order to maintain the stable operation of the system, based on the limited heat dissipation space and the realistic demand for rapid heat dissipation, the heat dissipation scheme of the laptop is generally presented in the form of combination, heat dissipation module is the most important heat dissipation mode of contemporary electronic products.

With the development of LED in the direction of miniaturization and high power, this trend leads to the generation of more heat in a limited volume. If the heat dissipation is not timely, excessive heat accumulation will lead to the rise of the working temperature of high-power LED, affecting the normal operation of high-power LED, and even make high-power LED failure in serious cases. The luminous efficiency of high-power LED is between 15%-25%, of which 75%-85% is converted into heat, LED junction temperature rises, its luminous efficiency decreases, the service life is shortened. It can be seen that temperature is one of the most important factors affecting the reliability of high-power LED, so it is necessary to take technical measures to limit the temperature rise of high-power LED.

The power consumption and heating of notebook computers are increasing with the enhancement of CPU and GPU performance. In order to maintain the stable operation of the system, based on the limited heat dissipation space and the realistic demand for rapid heat dissipation, the heat dissipation scheme of the laptop is generally presented in the form of combination, heat dissipation module is the most important heat dissipation mode of contemporary electronic products.

Heat dissipation has always been a major hindrance to PC performance. The more powerful the PC performance, the more severe the heat dissipation problem caused by data calculation. In order to solve this problem affecting the performance, all kinds of heat dissipation methods should be necessary.